High resolution for delicate surfaces

The sensor CWL HR (high-resolution) delivers extreme lateral resolution (< 0.7 μm) because of its modified optics and super-luminescent diode. It can be used to measure profiles and topography on reflective, rough, and light-absorbing surfaces. In the field of electronics, semiconductors, MEMS and nanotechnology it is used to characterize very fine structures such as step height, distance, and angles. Other typical applications of the CWL HR are the measurement of geometries in micro injection moulding or the characterization of surfaces in medical technology.

Fast film thickness measurement with infrared light

Thickness of semiconductor materials that are opaque in visible light but transparent in infrared light can be measured with the new CWL IR. Especially the semiconductor industry benefits from this when it comes to wafer measurements (i.e. TTV). The sensor offers a wide measuring range and a x,y resolution of 6.5 μm. In combination with MicroProf and MicroGlider systems it can furthermore be used for entire film thickness mappings.